The world’s first GREEN soldering product range from Stannol, distributed by Microsolder Kft. What does this mean? Basically, a sense of responsibility towards our environment and fellow human beings.
Solid solders
Solid solders are used for filling and refilling solder baths, as well as for applying solder in soldering procedures where the flux and solder are applied separately.
Our company distributes Loctite (formerly Multicore) and Stannol solid solders.
The widely used SN100C alloy also is available.
Forms of solid solders:
- pellets – for small solder pots, as gap filling material for filling empty solder tubs
- stick – for smaller solder baths
- bar – for automatic feeders with hanging holes
- wire – for hand and robotic soldering, and feeding pots with automatic level control
Solder alloys
| Alloy | Melting point | Designation | |||
| ISO DIN | Stannol | Loctite | |||
| Tin-lead | Sn60Pb40 | 183-188°C | S-Sn60Pb40E | S-Sn60Pb40E | 60EN |
| Sn63Pb37 | 183°C | S-63Pb37E | S-63Pb37E | 63EN | |
| Lead-free | SnCu0,7NiGe | 227°C | n.a. | SN100C | n.a. |
| Sn99,3Cu0,7 | 227°C | S-Sn99Cu1 | TC | 99C | |
| Sn96,5Ag3,5 | 221°C | S-Sn96Ag4 | TS | 96S | |
| Sn99Ag0,3Cu0,7 | 221-227°C | S-Sn98Cu1Ag | TSC0307 | n.a. | |
| Sn96,5Ag3,0Cu0,5 | 217-219°C | S-Sn96Ag3Cu1 | TSC305 | 97SC | |
| Sn95,5Ag3,8Cu0,7 | 217°C | S-Sn95Ag4Cu1 | TSC | 96SC | |
Cored solder wires
We also distribute Henkel Loctite/Multicore and Stannol products from Cored solder wires. Cored solder wires contain the flux in 1-5 cores. The following data are required for the correct determination of the solder wires:
- alloy
- flux name/identifier
- amount of flux
- wire diameter
- amount of solder wire per reel
Cored solder wire alloys
Alloy | Melting point | Notation | |||
| ISO DIN | Stannol | Loctite | |||
Tin-lead | Sn60Pb40 | 183-188°C | S-Sn60Pb40E | S-Sn60Pb40E | 60EN |
| Sn63Pb37 | 183°C | S-63Pb37E | S-63Pb37E | 63EN | |
| Sn62Pb26Ag2 | 179°C | S-Sn62Pb26Ag2 | S-Sn62Pb26Ag2 | Sn62 | |
Lead-free | SnCu0,7NiGe | 227°C | n.a. | SN100C | n.a. |
| Sn99,3Cu0,7 | 227°C | S-Sn99Cu1 | TC | 99C | |
| Sn96,5Ag3,5 | 221°C | S-Sn96Ag4 | TS | 96S | |
| Sn99Ag0,3Cu0,7 | 221-227°C | S-Sn98Cu1Ag | TSC0307 | n.a. | |
| Sn96,5Ag3,0Cu0,5 | 217-219°C | S-Sn96Ag3Cu1 | TSC305 | 97SC | |
| Sn95,5Ag3,8Cu0,7 | 217°C | S-Sn95Ag4Cu1 | TSC | 96SC | |
Fluxes and their classification according to the standard
| Manufacturer | Flux type | IPC-J-STD-004 IEC-61190-1-3 | ISO 9454-1 | Régi DIN |
Stannol | 2630 | ROM1 | 1.1.2.B | F-SW 26 |
| HS10 | ROM1 | 1.1.2.B | F-SW 26 | |
| Kristall 400 | REL0 | 1.2.3.B | F-SW 33 | |
| Kristall 600 | REL0 | 1.2.3.B | F-SW 33 | |
| Kristall 502 | REM1 | 1.2.2.B | F-SW 28 | |
| Kristall 505 | REM1 | 1.2.2.B | F-SW 28 | |
| Kristall 511 | REM1 | 1.2.2.B | F-SW 28 | |
| Trilence 2712 | REM1 | |||
| Trilence 2708 | REM1 | |||
| Trilence 3505 | REL1 | |||
| Trilence 3500 | REL0 | |||
| HF32 | REL0 | 1.1.3.B | F-SW 32 | |
| HF34 | ORM0 | 2.2.3.B | F-SW 34 | |
| KS100 | REL0 | 1.1.3.B | F-SW 32 | |
| KS115 | REM1 | 1.1.2.B | F-SW 28 | |
| X39B | REL0 | 1.1.3.B | F-SW 32 | |
Loctite/ Multicore | Crystall 400 | REL0 | 1.2.3.B | F-SW 33 |
| Crystall 502 | REM1 | 1.2.2.B | F-SW 28 | |
| Crystall 505 | REM1 | 1.2.2.B | F-SW 28 | |
| Crystall 511 | REM1 | 1.2.2.B | F-SW 28 | |
| 309 | ROM1 | 1.1.2.B | F-SW 26 |
The variety of fluxes ensures that you can choose the best solution for your given application. For example, 511 wets hard-to-solder surfaces very well when using lead-free solders. The Trilence series is especially suitable for laser or robotic soldering using solder irons, due to its extremely low spitting. Automotive industries and other high reliability industries, if cleaning (washing) is not used, require L0 and L1 flux types. For specific applications, ask our experts for help in choosing the optimal type.
Solder pastes
Our solder pastes are Stannol and Multicore manufactured by Harima. Depending on the application you can choose printable or dispensable versions, with leaded and lead-free solder alloys.
The pastes are characterized by a long open time and high tackiness, which is beneficial during printing and pick and place. The flux content of solder pastes leaves a safe residue after soldering. This is especially true for fully halogen-free (HF) types, which do not even contain the minimal amount of halogen compounds permitted by the IPC-J-STD-004 standard for halogen-free qualification.
Loctite GC10 solder paste is a very popular, is a room temperature stable, completely halogen-free solder paste. GC = Game Changer, i.e. solder paste that rewrites the game rules. It overturns the axioms that solder paste should be stored refrigerated. Not only can it be kept at room temperature, but it has a 1-year shelf life! In addition to the advantages of storage and transport, it is also very stable on the stencil. It can remain in the open air for a long time. If you restart the printing hours after stopping, you will still get an excellent print quality, and it is not a problem if it is assembled or reflowed hours after printing. The print deposit keeps its shape for a long time without slump, and is particularly suitable for fine pitch components. During reflow, the paste works excellently with either a linear or soak profile, the soak can be up to 200°C. Wets well on various surfaces. The residue after soldering does not require cleaning and it provides very good pin testing even after 7 days after reflow.
Loctite/Multicore GC18 solder paste with very low voids is a real novelty. Its main properties are similar to GC-10, but its temperature stability is even better, whether in terms of temperature effects during storage or during the process. The VOID level of less than 20% is better than the limit value included in the standards, and meets the strictest regulations of the automotive industry.
Most commonly used solder pastes
| Alloy | Type of solder paste | Powder particle size type (IPC-J-STD-005) | Flux classification (IPC-J-STD-004) | Properties, usage characteristics |
| Sn62Pb36Ag3 | Stannol SP 1200 | 3 | Lead, printable, general purpose | |
| Sn95,5Ag3,8Cu0,7 | TSC SP320 | 3 | ROL0 | dispendable |
| Sn95,5Ag3,8Cu0,7 | 96SC LF318 AGS88,5 | 3 | ROL0 | printable for general thermal profile |
| Sn95,5Ag3,8Cu0,7 | 96SC HF200 DAP88,5 | 4 | ROL0 | printable, completely halogen-free, for a general thermal profile |
| Sn99Ag0,3Cu0,7 | SAC0307 HF212 AGS88,5 | 3 | ROL0 | printable, completely halogen-free, for a long thermal profile |
| Sn95,5Ag3,8Cu0,7 | 96SC HF212 DAP88,5 | 4 | ROL0 | printable, completely halogen-free, for a long thermal profile |
| Sn90,95Ag3,8Cu0,7 Bi3,0Sb1,4Ni0,15 (Innolot) | 90iSC HF212 DAP88,5 | 4 | ROL0 | printable, completely halogen-free, for long thermal profile, automotive application |
| Sn96,5Ag3,0Cu0,5 | 97SC GC10 DAP88,5 | 4 | ROL0 | stable for 1 year at room temperature, printable, completely halogen-free, for a diverse thermal profile |
| Sn96,5Ag3,0Cu0,5 | 97SC GC18 DAP88,5 | 4 | ROL0 | stable for 1 year at room temperature, with low voiding, easy to print, completely halogen-free, for varied thermal profiles |
Liquid fluxes
Liquid fluxes for dip, wave soldering and selective soldering, a complete range of Loctite/Multicore and Stannol products.
For automotive suppliers, the Stannol 500-6B flux, accepted and proven in many places, can be the right choice, it can also be used for selective, wave soldering and dip tinning.
The 3.5% solids content of Stannol EF350 flux makes it suitable for both wave and selective soldering. A small part of the solids content is resin, which significantly increases the reliability of the residue compared to standard ORL0-classified materials.
Loctite/Multicore X33-12i flux is the ideal flux for double-wave or high-contact long-wave soldering equipment, as its components have been selected to remain active for the second (laminar) wave, thus ensuring proper soldering.
Natural resin (ROsin), artificial resin (REsin) and resin-free (ORganic) alcohol-based fluxes build up the product range, which makes it possible to meet high requirements even with non-high-tech production equipment.
In addition to alcohol-based fluxes, water-based fluxes are increasingly being used, which are environmentally friendly because they do not emit volatile organic compounds (VOC-free) and are not flammable.
Loctite/Multicore MF300 stands out for its high activity, which ensures proper soldering on oxidized, hard-to-solder surfaces.
Stannol’s water-based products, WF130, WF131 or semi-aqueous HW240, are popular. All provide low residue levels, good wetting, and at the same time high surface insulation resistance. It is also excellent under most conformal coatings.
The solids content of the fluxes can be selected from 2.4%.
Based on classification, you can choose from ROLO, ORLO, ROMO, ROM1.
If a particularly hard-to-solder surface (e.g. nickel or nickel coating, bronze, stainless steel, etc.) needs to be made solderable, ARAX (ORH1) flux may be the solution. Residues of this flux must be removed after soldering to prevent corrosion. A water wash is sufficient for cleaning. After tinning, soldering can be easily done with fluxes developed for electronic purposes.
Most commonly used liquid fluxes
| Type | Solvent | Solid content | By IPC-JSTD-004 classification | Characteristic property, field of use |
| X32-10i | IPA | 2,50% | ORL0 | For lead technology, low residue |
| X33-12i | IPA | 2,90% | ORM0 | For leaded or lead-free technology, low residue |
| MFR301 | IPA | 6,00% | ROM0 | Resin flux, also suitable for pre-tinning, safe, non-sticky, resin residue |
| EF350 | IPA | 3,50% | ORL0 | Good soldering and high reliability, also suitable for selective soldering, low residue |
| 500-6B | IPA | 6,00% | ROL0 | Resin material developed specifically for automotive use |
| MF300S | víz | 4,60% | ORM0 | VOC-free flux, effective, low residue |
| vagy | ||||
| MF220* | ||||
| WF130 | víz | 3,00% | ORL0 | VOC-free, high SIR |
| WF131 | víz | 2,60% | ORL0 | VOC-free, very low residue |
HW240 | félvizes | 2,40% | ORL0 | Reduced VOC content, lower power requirement, low residue |
| (víz/IPA) |
Rework materials
Even the most fine repairs can be made with Multicore, Stannol and ERSA repair materials. When repairing smaller parts or on hard-to-solder surfaces, a flux pen or gel-like flux can provide adequate results. ERSA FMKANC flux gel is also suitable for reballing BGA components. The pen filled with cleaning agent (cleaner pen) enables the cleaning of the repaired panel at the component level. The product range is completed by Multicore solder wicks. When the tip of soldering iron cannot be properly wetted by solder, tip tinner can help to solve the problem. Using it the life time of soldering tips can be increased, which can mean significant cost savings for large users. In the case of small users, the time and additional costs of purchasing a new tip are significant, so the savings are even more significant.
Masking materials
If we want to prevent tin from wetting certain areas of the PCB during wave soldering (if, for example, we do not want to delay the production of the panel due to a lack of parts), Harima’s Spot On Temporary soldering mask material can be the solution. The hardening of the material can be accelerated at elevated temperatures, and it can be peeled off from the panel after soldering.
More information:
Talk to our expert
Zoltán Jakab
business development and sales manager, certified IPC-A-610 and IPC-7711/21 Master Trainer
zoltan.jakab@microsolder.hu
+36 20 419 8216
Csaba Császár
salesperson, technical consultant, certified IPC-A-610 and IPC/WHMA-A-620 master trainer, IPC-A-600 and IPC-6012 trainer
csaba.csaszar@microsolder.hu
+36 20 501 9909
Zsolt Kovács
salesperson, technical consultant, certified IPC-A-610, IPC-A-620 and IPC 7711/21 trainer
zsolt.kovacs@microsolder.hu
+36 20 218 1685