The world’s first GREEN soldering product range from Stannol, distributed by Microsolder Kft. What does this mean? Basically, a sense of responsibility towards our environment and fellow human beings.

Solid solders

Solid solders are used for filling and refilling solder baths, as well as for applying solder in soldering procedures where the flux and solder are applied separately.
Our company distributes Loctite (formerly Multicore) and Stannol solid solders.

The widely used SN100C alloy also is available.

Forms of solid solders:

  • pellets – for small solder pots, as gap filling material for filling empty solder tubs
  • stick – for smaller solder baths
  • bar – for automatic feeders with hanging holes
  • wire – for hand and robotic soldering, and feeding pots with automatic level control

Solder alloys

AlloyMelting pointDesignation
ISO DINStannolLoctite
Tin-leadSn60Pb40183-188°CS-Sn60Pb40ES-Sn60Pb40E60EN
Sn63Pb37183°CS-63Pb37ES-63Pb37E63EN
Lead-freeSnCu0,7NiGe227°Cn.a.SN100Cn.a.
Sn99,3Cu0,7227°CS-Sn99Cu1TC99C
Sn96,5Ag3,5221°CS-Sn96Ag4TS96S
Sn99Ag0,3Cu0,7221-227°CS-Sn98Cu1AgTSC0307n.a.
Sn96,5Ag3,0Cu0,5217-219°CS-Sn96Ag3Cu1TSC30597SC
Sn95,5Ag3,8Cu0,7217°CS-Sn95Ag4Cu1TSC96SC

Cored solder wires

We also distribute Henkel Loctite/Multicore and Stannol products from Cored solder wires. Cored solder wires contain the flux in 1-5 cores. The following data are required for the correct determination of the solder wires:

  • alloy
  • flux name/identifier
  • amount of flux
  • wire diameter
  • amount of solder wire per reel
Töltött forraszhuzalokból szintén a Henkel (Loctite, korábban Multicore) és a Stannol termékeket forgalmazzuk.

Cored solder wire alloys

Alloy
Melting point
Notation
ISO DINStannolLoctite
Tin-lead
Sn60Pb40183-188°CS-Sn60Pb40ES-Sn60Pb40E60EN
Sn63Pb37183°CS-63Pb37ES-63Pb37E63EN
Sn62Pb26Ag2179°CS-Sn62Pb26Ag2S-Sn62Pb26Ag2Sn62
Lead-free
SnCu0,7NiGe227°Cn.a.SN100Cn.a.
Sn99,3Cu0,7227°CS-Sn99Cu1TC99C
Sn96,5Ag3,5221°CS-Sn96Ag4TS96S
Sn99Ag0,3Cu0,7221-227°CS-Sn98Cu1AgTSC0307n.a.
Sn96,5Ag3,0Cu0,5217-219°CS-Sn96Ag3Cu1TSC30597SC
Sn95,5Ag3,8Cu0,7217°CS-Sn95Ag4Cu1TSC96SC

Fluxes and their classification according to the standard

ManufacturerFlux typeIPC-J-STD-004 IEC-61190-1-3ISO 9454-1Régi DIN
Stannol
2630ROM11.1.2.BF-SW 26
HS10ROM11.1.2.BF-SW 26
Kristall 400REL01.2.3.BF-SW 33
Kristall 600REL01.2.3.BF-SW 33
Kristall 502REM11.2.2.BF-SW 28
Kristall 505REM11.2.2.BF-SW 28
Kristall 511REM11.2.2.BF-SW 28
Trilence 2712REM1  
Trilence 2708REM1  
Trilence 3505REL1  
Trilence 3500REL0  
HF32REL01.1.3.BF-SW 32
HF34ORM02.2.3.BF-SW 34
KS100REL01.1.3.BF-SW 32
KS115REM11.1.2.BF-SW 28
X39BREL01.1.3.BF-SW 32
Loctite/ Multicore
Crystall 400REL01.2.3.BF-SW 33
Crystall 502REM11.2.2.BF-SW 28
Crystall 505REM11.2.2.BF-SW 28
Crystall 511REM11.2.2.BF-SW 28
309ROM11.1.2.BF-SW 26

The variety of fluxes ensures that you can choose the best solution for your given application. For example, 511 wets hard-to-solder surfaces very well when using lead-free solders. The Trilence series is especially suitable for laser or robotic soldering using solder irons, due to its extremely low spitting. Automotive industries and other high reliability industries, if cleaning (washing) is not used, require L0 and L1 flux types. For specific applications, ask our experts for help in choosing the optimal type.

A sokféle töltet biztosítja azt, hogy adott felhasználási körülményekre a legjobb megoldást válasszuk. Az 511 például nagyon jól nedvesíti a nehezen forrasztható felületeket is ólommentes forraszok alkalmazása mellett.

Solder pastes

Forraszpasztáink Henkel gyártmányú Loctite (korábban Multicore) típusok. Nyomtatható és diszpenzelhető verziók a megfelelő alkalmazásoz, ólmos és ólommentes forraszötvözetekkel.Our solder pastes are Stannol and Multicore manufactured by Harima. Depending on the application you can choose printable or dispensable versions, with leaded and lead-free solder alloys.
The pastes are characterized by a long open time and high tackiness, which is beneficial during printing and pick and place. The flux content of solder pastes leaves a safe residue after soldering. This is especially true for fully halogen-free (HF) types, which do not even contain the minimal amount of halogen compounds permitted by the IPC-J-STD-004 standard for halogen-free qualification.
Loctite GC10 solder paste is a very popular, is a room temperature stable, completely halogen-free solder paste. GC = Game Changer, i.e. solder paste that rewrites the game rules. It overturns the axioms that solder paste should be stored refrigerated. Not only can it be kept at room temperature, but it has a 1-year shelf life! In addition to the advantages of storage and transport, it is also very stable on the stencil. It can remain in the open air for a long time. If you restart the printing hours after stopping, you will still get an excellent print quality, and it is not a problem if it is assembled or reflowed hours after printing. The print deposit keeps its shape for a long time without slump, and is particularly suitable for fine pitch components. During reflow, the paste works excellently with either a linear or soak profile, the soak can be up to 200°C. Wets well on various surfaces. The residue after soldering does not require cleaning and it provides very good pin testing even after 7 days after reflow.

Loctite/Multicore GC18 solder paste with very low voids is a real novelty. Its main properties are similar to GC-10, but its temperature stability is even better, whether in terms of temperature effects during storage or during the process. The VOID level of less than 20% is better than the limit value included in the standards, and meets the strictest regulations of the automotive industry.

A 20% alatti légzárvány (VOID) szintje jobb, mint a szabványokban foglalt határérték, megfelel az autóipar legszigorúbb előírásainak is.

Most commonly used solder pastes

AlloyType of solder pastePowder particle size type (IPC-J-STD-005)Flux classification (IPC-J-STD-004)Properties, usage characteristics
Sn62Pb36Ag3Stannol SP 12003 Lead, printable, general purpose
Sn95,5Ag3,8Cu0,7TSC SP3203ROL0dispendable
Sn95,5Ag3,8Cu0,796SC LF318 AGS88,53ROL0printable for general thermal profile
Sn95,5Ag3,8Cu0,796SC HF200 DAP88,54ROL0printable, completely halogen-free, for a general thermal profile
Sn99Ag0,3Cu0,7SAC0307 HF212 AGS88,53ROL0printable, completely halogen-free, for a long thermal profile
Sn95,5Ag3,8Cu0,796SC HF212 DAP88,54ROL0printable, completely halogen-free, for a long thermal profile
Sn90,95Ag3,8Cu0,7 Bi3,0Sb1,4Ni0,15 (Innolot)90iSC HF212 DAP88,54ROL0printable, completely halogen-free, for long thermal profile, automotive application
Sn96,5Ag3,0Cu0,5
97SC GC10 DAP88,5
4
ROL0
stable for 1 year at room temperature, printable, completely halogen-free, for a diverse thermal profile
 
  
Sn96,5Ag3,0Cu0,5
97SC GC18 DAP88,5
4
ROL0
stable for 1 year at room temperature, with low voiding, easy to print, completely halogen-free, for varied thermal profiles
 
 

Liquid fluxes

Liquid fluxes for dip, wave soldering and selective soldering, a complete range of Loctite/Multicore and Stannol products.

For automotive suppliers, the Stannol 500-6B flux, accepted and proven in many places, can be the right choice, it can also be used for selective, wave soldering and dip tinning.

The 3.5% solids content of Stannol EF350 flux makes it suitable for both wave and selective soldering. A small part of the solids content is resin, which significantly increases the reliability of the residue compared to standard ORL0-classified materials.
Loctite/Multicore X33-12i flux is the ideal flux for double-wave or high-contact long-wave soldering equipment, as its components have been selected to remain active for the second (laminar) wave, thus ensuring proper soldering.
Natural resin (ROsin), artificial resin (REsin) and resin-free (ORganic) alcohol-based fluxes build up the product range, which makes it possible to meet high requirements even with non-high-tech production equipment.
In addition to alcohol-based fluxes, water-based fluxes are increasingly being used, which are environmentally friendly because they do not emit volatile organic compounds (VOC-free) and are not flammable.
Loctite/Multicore MF300 stands out for its high activity, which ensures proper soldering on oxidized, hard-to-solder surfaces.

Stannol’s water-based products, WF130, WF131 or semi-aqueous HW240, are popular. All provide low residue levels, good wetting, and at the same time high surface insulation resistance. It is also excellent under most conformal coatings.
The solids content of the fluxes can be selected from 2.4%.
Based on classification, you can choose from ROLO, ORLO, ROMO, ROM1.
If a particularly hard-to-solder surface (e.g. nickel or nickel coating, bronze, stainless steel, etc.) needs to be made solderable, ARAX (ORH1) flux may be the solution. Residues of this flux must be removed after soldering to prevent corrosion. A water wash is sufficient for cleaning. After tinning, soldering can be easily done with fluxes developed for electronic purposes.

Most commonly used liquid fluxes

TypeSolventSolid contentBy IPC-JSTD-004  classificationCharacteristic property, field of use
X32-10iIPA2,50%ORL0For lead technology, low residue
X33-12i IPA2,90%ORM0For leaded or lead-free technology, low residue
MFR301IPA6,00%ROM0Resin flux, also suitable for pre-tinning, safe, non-sticky, resin residue
EF350IPA3,50%ORL0Good soldering and high reliability, also suitable for selective soldering, low residue
500-6BIPA6,00%ROL0Resin material developed specifically for automotive use
MF300S
víz
4,60%
ORM0
VOC-free flux, effective, low residue
vagy 
MF220*
WF130víz3,00%ORL0VOC-free, high SIR
WF131               víz2,60%ORL0VOC-free, very low residue
HW240
félvizes
2,40%
ORL0
Reduced VOC content, lower power requirement, low residue
(víz/IPA)

Rework materials

Even the most fine repairs can be made with Multicore, Stannol and ERSA repair materials. When repairing smaller parts or on hard-to-solder surfaces, a flux pen or gel-like flux can provide adequate results. ERSA FMKANC flux gel is also suitable for reballing BGA components. The pen filled with cleaning agent (cleaner pen) enables the cleaning of the repaired panel at the component level. The product range is completed by Multicore solder wicks. When the tip of soldering iron cannot be properly wetted by solder, tip tinner can help to solve the problem. Using it the life time of soldering tips can be increased, which can mean significant cost savings for large users. In the case of small users, the time and additional costs of purchasing a new tip are significant, so the savings are even more significant.

Masking materials

If we want to prevent tin from wetting certain areas of the PCB during wave soldering (if, for example, we do not want to delay the production of the panel due to a lack of parts), Harima’s Spot On Temporary soldering mask material can be the solution. The hardening of the material can be accelerated at elevated temperatures, and it can be peeled off from the panel after soldering.

More information:

www.stannol.de

Talk to our expert

Zoltán Jakab
business development and sales manager, certified IPC-A-610 and IPC-7711/21 Master Trainer
zoltan.jakab@microsolder.hu
+36 20 419 8216

Csaba Császár
salesperson, technical consultant, certified IPC-A-610 and IPC/WHMA-A-620 master trainer, IPC-A-600 and IPC-6012 trainer
csaba.csaszar@microsolder.hu
+36 20 501 9909

Csaba Pető
Executive, Director of Sales and Technical Support, Certified IPC-A-610 Master Trainer
csaba.peto@microsolder.hu
+36 20 464 1303

Zsolt Kovács
salesperson, technical consultant, certified IPC-A-610, IPC-A-620 and IPC 7711/21 trainer
zsolt.kovacs@microsolder.hu
+36 20 218 1685