VAPOR SOLDERING

Vapor phase soldering can provide a solution to the challenges of the soldering the latest components and panels. The vapor phase soldering technology in SMT production has a history of more than 40 years. This method is more efficient and protects electronic components compared to traditional soldering methods. Its advantage compared to currently used technologies is that the vapor provides a very uniform heat transfer during its condensation. 

Additional advantages:
– Without the use of N2, it creates a oxigen free atmosphere during reflow
– a highly reproducible process
– no time-consuming thermal profiling is required to set up the process
– no component or panel overheating during the process
– enables continuous, repeatable soldering quality, even in the case of components with the smallest solder joints, e.g.: BGA