Phase change materials
With increasingly small but increasingly powerful electronic devices, the dissipation of the generated heat plays an increasingly important role. Since among the components involved in heat dissipation, the material with the least thermal conductivity is the thermal paste or glue, so even a thin layer forms a significant part of the overall thermal resistance. This means that in the case of a poorly chosen material, the life of the equipment will be shorter or the equipment will not work at all. Henkel’s phase change heat conducting materials (PCTIM) are available in printable, dispensable, film-coated and cut-to-size forms. These materials can ensure the best heat transfer between the heat-producing component and the heatsink, as the thickness of the layer is minimal and the thermal conductivity is outstanding.
Thermally conductive pastes and adhesives
If the temperature of the component exceeds 150 degrees Celsius, then Henkel’s silicone-based thermal pastes can provide a suitable solution to the problem of heat dissipation.
In some cases, the thermally conductive material must also mechanically fasten the component, or the heatsink to the component, such as a thermocouple, or a component for which mechanical fixation of the heatsink cannot be solved in any other way. Among Loctite adhesives, we can find versions that contain glass balls to ensure a minimum adhesive thickness. These materials are labeled “Self Shimming”. Heat-conducting adhesives include acrylic-based (with activator and 2-component) materials, whose extremely fast curing properties are beneficial for mass production, silicone-based, which provide a solution for high-temperature applications, and epoxy-based (1 and 2-component) which create a bond with high mechanical strength.
Dielectric layers of metal-core circuit boards
In the case of metal core circuit boards, which are widely used mainly in the construction of LED light sources, a thin but good heat conductor and at the same time good electrical insulation layer is placed between the metal core and the copper foil layer used to form the conductive pattern. These panels are also known as IMS (Insulated Metal Substrates). The Bergquist company acquired by Henkel offers its motherboards under the Thermal Clad brand name. The HPL mark is made specifically for the purposes of LED light sources (High Power Lighting).
The light output, color (very important for white!), and the lifespan of LEDs all depend on the temperature of the LED chip, i.e. on the proper heat dissipation, which ensures a constant, acceptable temperature.
IMS base plates are available in different board sizes. Certain widely used circuit board shapes (rectangular star, etc.) can also be purchased ready-cut, even with a self-adhesive heat-conducting adhesive layer on the underside, with which they can be connected to a heatsink.
Talk to our expert
Császár Csaba
salesperson, technical consultant, certified IPC-A-610 and IPC/WHMA-A-620 master trainer, IPC-A-600 and IPC-6012 trainer
csaba.csaszar@microsolder.hu
+36 20 501 9909